Semi Mfg. Tech - LCC Mount/wire-bond
Full Time
Goleta, CA
$35,090 - $58,630 a year
Posted
Job description
Be visionary
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Job Description
Semiconductor Mfg. Tech (LLC Mount/wire bond) - Second Shift
Job Summary:
Performs functions associated with some backend wafer production operations, LCC mount and demount, and wire bond. Performs daily set-up, calibration and preventative maintenance tasks on semiconductor equipment.
Duties and Responsibilities:
- FPA inspection, mount into LCC, & wire bond for all programs. The goal is to meet daily requirements set by PC.
- Update CAMSTAR WIP tracking database.
- Organize lab and request for supplies and chemicals as needed
- Maintain high-level of cleanliness in lab
- Schedule and coordinate WIP for efficient movement of FPAs
- Sets daily priorities based on equipment availability and weekly production goals.
- Operate semiconductor equipment
Core Competencies:
- Attention to Detail
- Communication Skills (Oral, Written & Listening)
- Collaboration & Teamwork
- Coping
- Flexibility
- Initiative
- Organization & Planning
Essential Job Duties:
- Must be able to work in a clean room environment for extended periods of time
- Must be able to don and wear protective clothing including shoe covers, hair covers, “bunny suits” and facial masks for extended periods of time
- Must be able to read and communicate in writing using the English language
Education, Experience & Skill
- Minimum of 2 years of related experience required
- Excellent manual dexterity for wafer handling and die-level handling
- Inspection of film quality, using microscopes and an understanding of visual accept and reject criteria
- Gowning protocol for Class 10,000 clean room
- Some familiarity of basic wire-bond operation & system maintenance – desired
- Applicants must be either a U.S. citizen, U.S. national, legal permanent resident, asylee, refugee or must be eligible to apply for and obtain the appropriate export control license from the U.S. Departments of State or Commerce.
Salary Range:
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.
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